Ge Wafer (100) 2" dia x 0.5 mm, 1SP, P type ( Ga doped), resistivity: 0.0007-0.002 ohm-cm Li1.5Al0.5Ge1.5P3O12 controlled application of negative pressure
$108.67
Description
controlled application of negative pressure and safe bleeding
of the bottom can: 22mm
BK7 (Schott) - glass substrates
Optional You may order a pre-formed pouch cell case and other accessories by click the picture below right
Improper use is deemed to be all use for purposes deviating from those mentioned below
Ge Wafer (100) 2" dia x 0.5 mm, 1SP, P type ( Ga doped), resistivity: 0.0007-0.002 ohm-cm Li1.5Al0.5Ge1.5P3O12 controlled application of negative pressureGe Wafer Specification Growing Method: CZ Orientation: (100) + 0. 5 Deg. Wafer Size: 2" dia x 500 microns Surface Polishing: One side epi polished Surface roughness: < 8 A ( by AFM) Doping: Ga Doped Conductor type: P type Resistivity: 0. 0007 0. 002 ohm cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.) Package: under 1000 class clean room Typical Properties: Structure:
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