US$ 1942.00
LaAlO3,(110) 10x10x0.5 mm substrate , 2 side Epi polished - LAOe101005S2 Boron-Nitride on Silicon Cutting Dies Dimension
$94.64
Description
Cutting Dies Dimension
SS Milling Balls( Included)
Composition: Ge single crystal
40" x 30" x 28"
Provides larger discharging capability and longer service life for Li-Ion batteries
LaAlO3,(110) 10x10x0.5 mm substrate , 2 side Epi polished - LAOe101005S2 Boron-Nitride on Silicon Cutting Dies DimensionSubstrate Specifcations: Wafer Size: 10 x 10 x 0. 5 mm thickness + 0. 05 mm, Wafer Orientation: (110) + 0. 5 Deg Polishing: Two sides CMP polished with free sub surface damaged. Surface finish (RMS or Ra) : < 15A Package: Under 1000 class clean room, and in 100 grade plastic bag in a wafer container. Lattice Constant a=3. 792Pseudo cubic Warning: LaAlO3 crystal has a visible twin on a polished surface, which is normal nature . For detailed physical
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