Flex Electronics Webinar Master Class 21: September 25, 2024 Recording StdTpc-Silicon 2 Final assemblies should be

2  Final assemblies should be evaluated according to the criteria of SEMI S2 for environmental

FPD用ガラス基板サプライヤは，出荷前にこれらの情報を基板上のOCの周囲1箇所にマークすることで，基板情報管理を簡素化できる。さらに，このマーキングシンボルを使用することで，従来使用しているOCカットの形状の膨大な種類を，将来は削減することが可能になる。

SEMI E139 — Specification for Recipe and Parameter Management (RaP)

focusing on real world rather than algorithm development

SEMI T7 — Specification for Back-surface Marking of Double-side Polished Wafers with a Two-Dimensional Data Matrix Code Symbol

Flex Electronics Webinar Master Class 21: September 25, 2024 Recording StdTpc-Silicon 2 Final assemblies should beRecording of the Flex Electronics Master Class: Navigating the Legal Landscape: AI Litigation Risks in Semiconductor and Medtech. CANCELLATION POLICY: This is recording of an on line event. You will receive the access information upon completion of the registration. We are not processing refunds or cancellations. EVENT CONTACT: Paul Cohen Email: pcohen@semi. org