M01500 - SEMI M15 - 半絶縁ガリウムヒ素ウェーハ用の鏡面ウェーハの許容表面欠陥表 StdVol-Safety Guidelines SEMI MF657 — Test Method

SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 0914)

This Document provides guidance for specifying edge trimming and resultant particle count to ensure the successful wafer thinning process after the wafer edge trimming

For the purpose of this test HCl is the preferred test gas

To determine the impurity capacity of a gas purifier at the point of breakthrough

Knowledge of these characteristics can help the supplier and customer determine if the dimensional characteristics of a particular wafer satisfy given geometrical requirements

M01500 - SEMI M15 - 半絶縁ガリウムヒ素ウェーハ用の鏡面ウェーハの許容表面欠陥表 StdVol-Safety Guidelines SEMI MF657 — Test MethodGaAs Referenced SEMI Standards None.