E17600 - SEMI E176 - Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Revision:SEMI E176-1017 - Superseded originally published March 2003

originally published March 2003

SEMI E35-0304 (designation update)

7-0304 (technical revision)

1-0414 — Specification for SOAP Binding for Equipment Self Description (EqSD)

01 ppba and 5 ppba for each of the electrically active elements

E17600 - SEMI E176 - Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Revision:SEMI E176-1017 - Superseded originally published March 20031 Purpose 1. 1 The purpose of this Guide is to provide guidance for the assessment and minimization of electromagnetic interference (EMI) in a semiconductor manufacturing environment to improve yield, equipment availability, and test results (e. g., testing time, measurement relevance, repeatability, and accuracy). 2 Scope 2. 1 This Guide applies to equipment and facilities provided for the purpose of manufacturing semiconductor devices (i. e.,