G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E133-1104 (technical revision)

SEMI E133-1104 (technical revision)

1-95 (Withdrawn 0304)

SEMI D34-0710 (technical revision)

• extract the edge profile parameters directly from the measured edge profile at defined distances from the periphery of the wafer and compare them with the specified values

E本スタンダードは2006年5月に編集上の修正がなされた。修正箇所は，¶10

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E133-1104 (technical revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.